Bosch Packaging Technology presents its latest development: the next generation Human Machine Interface HMI 4.0, suited for both stand-alone machines and entire lines.
Beckhoff Automation will showcase system-integrated solutions for IoT and Industrie 4.0, with advanced IoT hardware, combining to demonstrate practical implementation of cloud-connected Smart Factory concepts.
Brands and suppliers get world’s first preview of new cloud platform that enables better collaboration to shorten time to market for new products and promotions at Pack Expo.
The highlight of this year’s exhibit will be demonstrations of Cognex’s DS1000 series of 3D displacement sensors, which address 3D applications that demand high resolution and expanded measurement range, such as measuring height, volume and tilt of parts.
Eagle Product Inspection, a provider of physical contamination detection and quality assurance equipment, will showcase a number of advanced technology and software solutions at Pack Expo 2016.