Ampac Adds Inno-Lok and Pour & Lok Zipper Application Technology
Ampac announces the addition of Inno-Lok, a patented method of applying a reclosable zipper transversely to packaging films, as well as Pour & Lok, a foldable zipper applied to film in the side gusset area of a package. The Inno-Lok technology is applied transversely to packaging films producing pre-zippered roll stock film which can be used in form, fill and seal packaging applications. Inno-Lok will be offered on Ampac’s coextruded surface printed films and laminated films, for both barrier and non-barrier end uses.
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Ampac announces the addition of Inno-Lok, a patented method of applying a reclosable zipper transversely to packaging films, as well as Pour & Lok, a foldable zipper applied to film in the side gusset area of a package. The Inno-Lok technology is applied transversely to packaging films producing pre-zippered roll stock film which can be used in form, fill and seal packaging applications. Inno-Lok will be offered on Ampac’s coextruded surface printed films and laminated films, for both barrier and non-barrier end uses.