Floor to Cloud solutions empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity, sustainability and safety.
The INDEVCO Packaging Solutions division will unveil its latest advancements in sustainable packaging materials, featuring lightweight, downgauged paperboard and plastic options made from renewable or recycled raw materials at Booth #N9254.
BW's booth will be organized in alignment with five lines of business: BW Flexible Systems, BW Rigid Systems, BW Labeling, BW End-of-Line and BW Integration.
CoreTigo will be demonstrating the unique capabilities and new applications enabled by cable-grade industrial wireless connectivity in collaboration with both the Rotzinger Group and Rockwell Automation.
From September 11–13, experts from North America and Germany will be at Booth C-1841 introducing customers to Waldner’s high-quality machines and sharing their extensive knowledge on sustainable operations.
The state-of-the-art technology combines the agility and speed of digital printing with exceptional print quality, a wide color spectrum and minimal energy consumption.
