The highlight of this year’s exhibit will be demonstrations of Cognex’s DS1000 series of 3D displacement sensors, which address 3D applications that demand high resolution and expanded measurement range, such as measuring height, volume and tilt of parts.
Eagle Product Inspection, a provider of physical contamination detection and quality assurance equipment, will showcase a number of advanced technology and software solutions at Pack Expo 2016.
Expecting more than 50,000 processing and packaging professionals, over 2,300 exhibitors, 100-plus educational sessions and serving over 40 vertical markets, PACK EXPO International is the place to be.
This fall, PACK EXPO International will serve as a hub of innovation, helping packagers and processors tackle challenges in all of these areas across a range of industries.
Dorner’s innovative approach to developing material handling solutions through its engineered solutions group will be one of many things on display in at PACK EXPO.
As brands seek to tap into sustainability and wellness trends, brand owners can make significant strides in the arena with clean labels, transparency – both figuratively and literally – and by striving to reduce their carbon footprint throughout the supply chain.
The Contract Packaging Association (CPA) hosts the Contract Packaging Sourcing Center at PACK EXPO International in Chicago on Nov. 6-9 at McCormick Place.