In an industry constantly optimizing materials, design and processing technologies, it’s hard to keep pace, let alone apply new technologies to your advantage. DuPont Packaging & Industrial Polymers (P&IP) understands the “time crunch” and has converted its PACK EXPO meeting room in South Hall 501 into a collaboration space, inviting innovators in the value chain to join DuPont in several panels and conversations designed to stimulate new ideas.
PACK EXPO runs from Nov. 2 to Nov. 5 at McCormick Place in Chicago, IL.
“The best ideas stem from collaboration around global challenges and we want to bring that environment to Chicago,” said William T. Cunningham, P&IP packaging director, North America. “PACK EXPO, which reaches all industry leaders throughout the value chain, has proven to be a great venue to generate new ideas.”
Monday, Nov. 3 from noon – 1:30 p.m. CST: "Not Your Average Technology Talk"
P&IP Research & Development Director David Dean moderates a session with leaders from Mintel Group, Ltd., Macro Engineering & Technology, Inc., Brampton Engineering, AVURE Technologies, Inc. and Kortec. These leaders will explore key technology trends and highlight the benefits of technologies that include micro-foamed layers in cast coextruded film, water-quenched coextruded blown film, high-pressure pasteurization and co-injection molding.
Tuesday, Nov. 4 from 9:30 a.m. to 11 a.m. CST: “Conversation on Food Waste and the Role of Packaging”
DuPont, Unilever and Sealed Air discuss the role of packaging and the need for collaboration in mitigating food loss and waste in a session moderated by James D. Downham, president and CEO of PAC, the Packaging Consortium.
Tuesday, Nov. 4 from noon to 1 p.m. CST: "From Body Armor to Packaging"
Diane Hahm, P&IP senior technical consultant, shows how the computer model to test body armor made with DuPont™ Kevlar® fiber was adapted to simulate packages being punctured in the filling line.
Wednesday, Nov. 5 from 10 a.m. to 11 a.m. CST: "Honoring Packaging Innovation"
Everything you wanted to know but were afraid to ask about the DuPont Awards for Packaging Innovation is covered in this session led by DuPont Awards Leader Yasmin Siddiqi and lead judge David Luttenberger of Mintel Group, Ltd. They will review winning case studies, provide tips and introduce an Advisory Panel designed to keep the program fresh and relevant.
DuPont also is participating in the Food Safety Summit Resource Center in booth 2962. Siddiqi is scheduled to discuss Packaging’s Contribution to Reducing Food Waste on Monday, Nov. 3 from 1:15 p.m.to 1:45 p.m. CST.
For more about DuPont activities at PACK EXPO, please visit packexpo.dupont.com.
