Packaging sessions unwrapped for 2015 PROCESS EXPO UNIVERSITY
The Food Processing Suppliers Association (FPSA, fpsa.org) releases its slate of packaging sessions as part of the PROCESS EXPO UNIVERSITY educational program taking place at Chicago's McCormick Place from September 15-18, 2015. The packaging sessions will be led by academics from the leading packaging educational institutions in the world, including professors from Michigan State University, Purdue University, University of Guelph and the International Safe Transit Association.
“We are excited to have the most respected academics from the packaging industry speaking at PROCESS EXPO this year," says Gil Williams, chairman of the Food Processing Suppliers Association (FPSA) and president of Poly-clip System USA and Canada. “Show attendees know that we provide the highest level of educational sessions and do not merely provide a stage for vendors to promote their equipment. The results speak for themselves as the packaging sessions within the educational program have proven to be among the most highly attended at PROCESS EXPO.”
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