Robust Education Comes to PACK EXPO Las Vegas Floor
Professional development complements what you’ll find on the show floor at PACK EXPO’s largest Las Vegas show to date
To address today’s vital manufacturing trends and challenges, PACK EXPO Las Vegas (Sept. 23–25, 2013; Las Vegas Convention Center) will bring industry expertise to the show floor with free, convenient educational programming. Sessions presented by suppliers and other industry experts will take place throughout the show floor, with locations that include the Innovation Stage (Booths C-141, C-142 and C-143), the Center for Trends & Technology, sponsored by Rockwell Automation and its Partner Network™ (Booth C-1358) and the Food Safety Summit Resource Center, sponsored by GE Intelligent Platforms and BNP Media (Booth S- 7332).
Exclusive Insights: Gain access to in-depth insights and best practices for trends, solutions and innovations for consumer packaged goods processors responsible for food, beverage, household, medical and pharmaceutical packaging.
Comprehensive Coverage: Stay informed with the latest news and trends through our videos, podcasts, eNewsletters, webinars, continuing education resources, and a monthly eMagazine.
Networking Opportunities: Connect with other industry professionals and leaders through our webinars and online platforms.
